Metal Bond Diamond Grinding Wheel for Chamfering Semiconductor Silicon Wafers
Metal Bond Diamond Grinding Wheel for Chamfering Semiconductor Silicon Wafers

Metal Bond Diamond Grinding Wheel for Chamfering Semiconductor Silicon Wafers

  • Used for processing high-hardness materials such as ceramics, glass, stone, hard alloys, etc.

    Has excellent wear resistance, hardness, and cutting performance.

    Minimum Order Quantity: 10pcs

    Net Weight: 680g

    Payment:30% advance

Whatspp:+86 18168916667
E-mail:kingrong@weiert-ceramics.com

Detail

Description
The metal diamond grinding wheel used for chamfering semiconductor silicon wafers is a superhard material grinding wheel with high precision and wear resistance. It plays an important role in the semiconductor industry and is of great significance for improving the quality and reliability of silicon wafer processing.

 

Specifications

Place of Origin China
Brand Name Jiangsu Xingzuan Superhard Material Technology Co., Ltd
Certification CNIPA
Abrasive Diamond
Bond Metal bond
Abrasive Grit Size 1500#
Model Number 1A1
Specification 120*25*22*10*25
Net Weight 680g
Minimum Order Quantity 10pcs
Delivery Time 30 days from advance payment
Supply Ability Support customization
Payment 30% advance

 

Applications

    In the semiconductor industry, it is mainly used for chamfering of silicon wafers, aiming to remove burrs, edges, and cracks at the edges of the wafer, reduce the possibility of edge breakage in subsequent processes, and improve the overall quality and reliability of the wafer.

     

    Competitive Advantage

    • Stability and durability under high-speed rotation and heavy load processing conditions.
    • It has strict shape accuracy and size control to meet the requirements of high-precision machining.
    • Good self-sharpening ability, maintaining the cutting performance and processing efficiency of the grinding wheel during the machining process.
Get In Touch

Send Your Message