Resin Bond Diamond Centerless Grinding Wheel
Resin Bond Diamond Centerless Grinding Wheel

Resin Bond Diamond Centerless Grinding Wheel

  • It is suitable for processing various materials, such as ceramics, hard alloys, etc.

    Have the characteristics of high efficiency, wear resistance, and high precision.

    Minimum Order Quantity: 5pcs

    Net Weight: 8.2KG

    Payment:30% advance

Whatspp:+86 18168916667
E-mail:kingrong@weiert-ceramics.com

Detail

Description
The Resin bonded diamond centerless grinding wheels have high efficiency, wear resistance, and accuracy. This type of grinding wheel plays an important role in centerless grinding and is suitable for the precision machining of various materials such as ceramics and hard alloys.
 
Specifications

Place of Origin China
Brand Name Jiangsu Xingzuan Superhard Material Technology Co., Ltd
Certification CNIPA
Abrasive Diamond
Bond Resin bond
Model Number 1A1
Abrasive Grit Size 80/100
Specification 350*125*127*10*125
Outside Diameter 350mm
Hole 127mm
Total Thickness 125mm
Net Weight 8.2KG
Minimum Order Quantity 5pcs
Delivery Time 30 days from advance payment
Supply Ability Support customization
Payment 30% advance

 

Applications

  • Used for rough grinding, semi-precision grinding, and precision grinding processes of hard alloys, ceramics, magnetic materials, and other materials.
  • It plays an important role in the processing, forming, and grinding of hard alloy blades, as well as the precision machining of ceramics, magnetic materials, and other materials.

 
Competitive Advantage

  • High hardness, good wear resistance, can effectively remove workpiece materials, and improve processing efficiency.
  • It can maintain a stable distribution of abrasives, ensuring that the grinding wheel maintains high precision during the grinding process and meets the requirements of precision machining.
  • Widely applicable, suitable for centerless grinding of materials such as ceramics, hard alloys, optical glass, etc.
Get In Touch

Send Your Message