Rebolo de diamante Metal Bond para chanfrar pastilhas de silício semicondutoras
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Used for processing high-hardness materials such as ceramics, glass, stone, hard alloys, etc.
Has excellent wear resistance, hardness, and cutting performance.
Quantidade mínima de encomenda: 10pcs
Net Weight: 680g
Payment:30% advance
- Whatspp：+86 13357928197
- E-mail：wang@jyxhzs.com
Detalhes
Descrição
The metal diamond grinding wheel used for chamfering semiconductor silicon wafers is a superhard material grinding wheel with high precision and wear resistance. It plays an important role in the semiconductor industry and is of great significance for improving the quality and reliability of silicon wafer processing.
Especificações
| Local de origem | China |
| Nome da marca | Jiangsu Xingzuan Superhard Material Technology Co., Ltd |
| Certificação | CNIPA |
| Abrasivo | Diamante |
| Obrigação | Metal bond |
| Tamanho do grão abrasivo | 1500# |
| Número do modelo | 1A1 |
| Especificação | 120*25*22*10*25 |
| Peso líquido | 680g |
| Quantidade mínima de encomenda | 10 unidades |
| Prazo de entrega | 30 dias após o pagamento do adiantamento |
| Capacidade de fornecimento | Personalização do suporte |
| Pagamento | Avanço 30% |
Aplicações
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In the semiconductor industry, it is mainly used for chamfering of silicon wafers, aiming to remove burrs, edges, and cracks at the edges of the wafer, reduce the possibility of edge breakage in subsequent processes, and improve the overall quality and reliability of the wafer.
- Stability and durability under high-speed rotation and heavy load processing conditions.
- It has strict shape accuracy and size control to meet the requirements of high-precision machining.
- Good self-sharpening ability, maintaining the cutting performance and processing efficiency of the grinding wheel during the machining process.
Vantagem competitiva
