Muela de diamante con ligante metálico para biselar obleas de silicio semiconductoras
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Used for processing high-hardness materials such as ceramics, glass, stone, hard alloys, etc.
Has excellent wear resistance, hardness, and cutting performance.
Cantidad mínima de pedido: 10pcs
Peso neto: 680 g
Pago:30% anticipo
- Whatspp：+86 13357928197
- Correo electrónico：wang@jyxhzs.com
Detalle
Descripción
The metal diamond grinding wheel used for chamfering semiconductor silicon wafers is a superhard material grinding wheel with high precision and wear resistance. It plays an important role in the semiconductor industry and is of great significance for improving the quality and reliability of silicon wafer processing.
Especificaciones
| Lugar de origen | China |
| Marca | Jiangsu Xingzuan Tecnología de Materiales Superduros S.L. |
| Certificación | CNIPA |
| Abrasivo | Diamante |
| Bono | Unión metálica |
| Tamaño de grano abrasivo | 1500# |
| Número de modelo | 1A1 |
| Especificación | 120*25*22*10*25 |
| Peso neto | 680g |
| Cantidad mínima de pedido | 10 unidades |
| Plazo de entrega | 30 días a partir del pago por adelantado |
| Capacidad de suministro | Apoyo a la personalización |
| Pago | 30% avance |
Aplicaciones
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In the semiconductor industry, it is mainly used for chamfering of silicon wafers, aiming to remove burrs, edges, and cracks at the edges of the wafer, reduce the possibility of edge breakage in subsequent processes, and improve the overall quality and reliability of the wafer.
- Stability and durability under high-speed rotation and heavy load processing conditions.
- It has strict shape accuracy and size control to meet the requirements of high-precision machining.
- Good self-sharpening ability, maintaining the cutting performance and processing efficiency of the grinding wheel during the machining process.
Ventaja competitiva
